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James P. Becker
Associate Professor
535 Cobleigh Hall
Bozeman, MT 59717

Tel: (406) 994-5988
Fax: (406) 994-5958
jbecker@ece.montana.edu

ECE Department
Montana State University
610 Cobleigh Hall
Bozeman, MT 59717

Tel: (406) 994-2505
Fax: (406) 994-5958
eedept@ee.montana.edu www.coe.montana.edu/ee

> College of Engineering > Electrical & Computer Engineering Department
Journal and Conference Publications

Published Work:

  • James P. Becker, Carolyn Plumb and Richard Revia Project Circuits in the Teaching of A Basic Electric Circuits Course, IEEE Transaction on Education, Vol 99 July 2013.

  • James P. Becker, Carolyn Plumb and Richard Revia The Use of A Project Circuit in the Teaching of A Basic Electric Circuits Course, Proceeding of the 2012 ASEE Annual Conference and Exposition, June 2012.

  • William R.F. Holleder and James P. Becker, Development of A Doppler Radar Experiment Board For Use in Microwave Circuits and Electronics Courses, Proceeding of the 2010 ASEE Annual Conference and Exposition, June 2010.

  • James P. Becker, Using Antenna Arrays To Motivate the Study of Sinusoids, IEEE Transactions on Education, Vol 53, Issue 2, pp.209-215.

  • Lance Ang Li, Brandon J. Hilliard, Jonathan R. Shafer, Josephine Daggett, Edward J. Dickman and James P. Becker, A Planar Compatible Traveling Wave Waveguide-Based Power Divider/Combiner, IEEE Transactions on Microwave Theory and Techniques, Vol. 56 (8), August 2008, pp. 1889-1898.

  • James P. Becker, Weaving a Microwaves Thread Through The Curriculum,Proceeding of the 2008 ASEE Annual Conference and Exposition, June 2008.

  • William Bucossi and James P. Becker, Practical Considerations in the Use of CMOS Active Inductors, Digest of the 2008 IEEE Topical Meeting on Silicon In RF Systems, ISBN 978-1-4244-1856-5, pp. 90-93, January 2008.

  • Edward J. Dickman and James P. Becker, Towards a Traveling Wave Power Distribution Module Using Micromachined Packaging IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, October (2005) IEEE #05TH881 pp. 139-142.

  • James P. Becker and Adil M. Oudghiri, A Planar Probe Double Ladder Waveguide Power Divider
    IEEE Microwave and Wireless Components Letters, Vol. 15 (3), March 2005.

  • Robert C. Maher, James Becker, Tia Sharpe, James Peterson and Bradford A. Towle, Development and Implementation of a Robot-based Freshman Engineering Course, Proceedings of the 2005 American Society for Engineering Education Annual Conference and Exposition.

  • Yongshik Lee, James P. Becker, Jack R. East and Linda P.B. Katehi, Fully Micromachined Finite-Ground Coplanar Line-to-Waveguide Transitions for W-Band Applications, IEEE Transactions on Microwave Theory and Techniques, Vol. 52 (3), March 2004.

  • James P. Becker, Jack R. East, and Linda P.B. Katehi, Performance of a Silicon Micromachined Waveguide at W-Band, IEE Electronics Letters, Vol. 38 (13), June 2002, pp. 138-139.

  • Yongshik Lee, James P. Becker, Jack R. East, and Linda P.B. Katehi, A Micromachined Finite Coplanar Line-to-Silicon Micromachined Waveguide Transition For Millimeter and Submillimeter Applications, 2002 IEEE MTT-S International Microwave Symposium Digest, Vol. 3 (2002), pp. 1871-1874.

  • James P. Becker, Yongshik Lee, Jack R. East, and Linda P.B. Katehi, A Finite Ground Coplanar Line-to-Silicon Micromachined Waveguide Transition, IEEE Transactions on Microwave Theory and Techniques, Vol. 49 (10), October 2001.

  • Alexandros Margomenos, Dimitrios Peroulis, James P. Becker, and Linda P.B. Katehi, Silicon Micromachined Interconnects for On-wafer Packaging of MEMS Devices, IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, Cat. No. EX496-TBR, ISBN 0-7803-7129-1 (2001).

  • James P. Becker, Yongshik Lee, Jack R. East, and Linda P.B. Katehi, A Fully-Packaged Finite-Ground Coplanar Line-To-Micromachined Waveguide Transition, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging, Cat. No. 00TH8524, pp. 273-276 (2000).

  • James P. Becker and Linda P.B. Katehi, Multilevel Finite Ground Coplanar Line Transitions For High-Density Packaging Using Silicon Micromachining, 2000 MTT-S International Microwave Symposium Digest, Vol. 1 303-306 (2000).

  • James P. Becker and Linda P.B. Katehi, Toward a Novel Planar Circuit Compatible Silicon Micromachined Waveguide, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging Cat. No. 99TH8412, pp. 221-224 (1999).

  • A. Vantomme, G. Langouche, J.E. Mahan and J.P. Becker, Growth Mechanisms and Optical Properties of Semiconducting Mg2Si Thin Films, Microelectronic Engineering, Vol. 50, pp. 237-242 (2000).

  • André Vantomme, John E. Mahan, Guido Langouche, James P. Becker, Margriet Van Bael, Kristiaan Temst, and Chris Van Haesendonck,Thin Film Growth of Semiconducting Mg2Si By Codeposition, Applied Physics Letters, Vol. 70 (9), pp. 1086-1088 (1997).

  • John E. Mahan, André Vantomme, Guido Langouche, and James P. Becker, Semiconducting Mg2Si Thin Films Prepared By Molecular-Beam Epitaxy, Physical Review B, Vol. 54 (23), pp 16965-16971 (1996).

  • James P. Becker, John E. Mahan, and Robert G. Long ReSi2 Thin-Film Infrared Detectors, Journal of Vacuum Science and Technology A, Vol. 13 (3), pp. 1133-1135 (1995).

  • Robert G. Long, James P. Becker, John E. Mahn, André Vantomme, and Marc-A. Nicolet, Heteroepitaxial Relationships for CrSi2 Thin Films on Si(111), Journal of Applied Physics, Vol. 77 (7) pp. 3088-3094 (1995).

  • Robert G. Long, James P. Becker, and John E. Mahan, Infrared Detection With a ReSi2 Thin Film Photoresistor, Applied Physics Letters, Vol. 66 (7), pp. 875-876 (1995).

  • James P. Becker, Robert G. Long, and John E. Mahan, Reflection High-Energy Electron Diffraction Patterns of Carbide-Contaminated Silicon Surfaces, Journal of Vacuum Science and Technology A, Vol. 12 (1), pp. 174-178 (1994).

    Patents:

  • Margomenos, Herrick, Becker, Katehi: On-Wafer Packaging for RF-MEMS, US Patent 6,696,645



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